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HP Apollo 2000 Maintenance And Service Manual
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HP Apollo 2000 Maintenance And Service Manual

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HP Apollo 2000 System
Maintenance and Service Guide
Abstract
This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and
software. This guide is for an experienced service technician. HP assumes that you are qualified in the servicing of computer equipment, trained in
recognizing hazards in products, and are familiar with weight and stability precautions.
Part Number: 798329-001
March 2015
Edition: 1

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  • Page 1 This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.
  • Page 2 © Copyright 2015 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

  • Page 3: Table Of Contents

    RPS link board ............................50 RCM 2.0 cable ............................52 Drive backplane ............................54 Fan module ............................55 HP Smart Storage Battery ......................... 56 Hot-plug drive ............................58 Bezel ear ............................... 59 FBWC module ............................61 RCM 2.0 to 1.0 adapter cable ......................... 63 Dedicated iLO management port module option ..................
  • Page 4 Secure Boot configuration ....................... 90 Embedded UEFI shell ........................91 Embedded Diagnostics option ......................91 HP RESTful API support for UEFI ....................... 91 Re-entering the server serial number and product ID ................91 HP ProLiant Pre-boot Health Summary ......................92 HP Insight Diagnostics ..........................
  • Page 5 Drive backplane power cabling ..................... 119 RCM 2.0 cabling ........................120 Fan power cabling ........................120 Fan cabling ..........................121 HP Smart Storage Battery cabling ....................121 Node cabling ............................122 Storage cabling .......................... 122 Graphic card/ coprocessor cabling ....................124 FBWC module cabling .........................

  • Page 6: Customer Self Repair

    HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material.
  • Page 7 HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
  • Page 8 La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
  • Page 9 Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:...
  • Page 10 HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.
  • Page 11 Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
  • Page 12 No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço. Customer self repair 12...
  • Page 13 Customer self repair 13...
  • Page 14 Customer self repair 14...
  • Page 15 Customer self repair 15...

  • Page 16: Illustrated Parts Catalog

    Illustrated parts catalog System components HP continually improves and changes product parts. For complete and current supported parts information, see the HP PartSurfer website (http://partsurfer.hp.com). Chassis system components Item Description Spare part Customer self number repair (on page 6) 12 low-profile LFF drive cage —...
  • Page 17 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
  • Page 18 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.
  • Page 19 Illustrated parts catalog 19...

  • Page 20: Node System Components

    Node system components Item Description Spare part Customer number self-repair Air baffle kit (includes 1U baffle and 2U baffle) 811223-001 Mandatory 1U air baffle — — 2U air baffle — — DIMM — — a) 4 GB, single-rank x8 PC4-2133R-15 774169-001 Mandatory b) 8 GB, single-rank x4 PC4-2133R-15*...
  • Page 21 Item Description Spare part Customer number self-repair c) 1.9-GHz Intel Xeon E5-2609 v3, 6C, 85W* 762443-001 Optional d) 2.3-GHz Intel Xeon E5-2698 v3, 16C, 135W* 780760-001 Optional e) 2.3-GHz Intel Xeon E5-2670 v3, 12C, 120W* 762450-001 Optional f) 2.3-GHz Intel Xeon E5-2650 v3, 10C, 105W* 762448-001 Optional g) 2.4-GHz Intel Xeon E5-2630 v3, 8C, 85W*...
  • Page 22 Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.
  • Page 23 Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

  • Page 24: Removal And Replacement Procedures

    • T-10/T-15/T-20 Torx screwdriver • Flathead screwdriver (for replacing the system battery) • HP Insight Diagnostics (on page 92) • Thin-nose pliers (for replacing the chassis power distribution board). Safety considerations Before performing service procedures, review all the safety information.

  • Page 25: Server Warnings And Cautions

    Get help to lift and stabilize the product during installation or removal, especially when the • product is not fastened to the rails. HP recommends that a minimum of two people are required for all rack server installations. A third person may be required to help align the node if the server is installed higher than chest level.

  • Page 26: Rack Warnings

    Rack warnings WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: The leveling jacks are extended to the floor. • The full weight of the rack rests on the leveling jacks. • The stabilizing feet are attached to the rack if it is a single-rack installation. •...

  • Page 27: Power Down The System

    • Remove the air baffle (on page 38). • Remove the bayonet board assembly (on page 39) • Remove the bayonet board bracket (on page 40). • Remove the PCI riser cage assembly (on page 41). Power down the system IMPORTANT: When the nodes are in standby mode, auxiliary power is still being provided to the system.

  • Page 28: Remove The Power Supply

    1U node 2U node CAUTION: To avoid damage to the device, do not use the removal handle to carry it. Place the node on a flat, level surface. Remove the power supply To remove the component: Power down the system (on page 27). Access the product rear panel.

  • Page 29: Remove The Rcm Module

    Remove all power: Disconnect the power cord from the power source. Disconnect the power cord from the chassis. Remove the power supply. Remove the RCM module To remove the component: Power down the system (on page 27). Access the product rear panel. Disconnect all cables from the RCM module.

  • Page 30: Remove The Chassis From The Rack

    Remove the chassis from the rack WARNING: The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment: Observe local occupational health and safety requirements and guidelines for manual • material handling. Remove all installed components from the chassis before installing or moving the chassis. •...

  • Page 31: Remove The Security Bezel

    Place the chassis on a flat surface. Remove the security bezel To access the front panel components, unlock and then remove the security bezel. Remove the PDB cover Power down the system (on page 27). Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis ("Remove the node from the chassis"...

  • Page 32: Remove The Chassis Access Panel

    If an HP Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. Remove the PDB cover (on page 31).

  • Page 33: Remove The Fan Cages

    If installed, remove the RCM module (on page 29). Remove all power supplies ("Remove the power supply" on page 28). Remove the chassis from the rack (on page 30). Unlock the access panel latch using the T-15 Torx screwdriver and release the access panel latch. Slide the access panel back about 1.5 cm (0.5 in).

  • Page 34: Remove The Chassis Pdb Assembly

    Right fan cage Left fan cage Remove the chassis PDB assembly To remove the component: Power down the system (on page 27). Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis ("Remove the node from the chassis"...
  • Page 35 ("Remove the chassis access panel" on page 32). If an HP Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable.

  • Page 36: Remove The 1U Left Rear I/O Blank

    Disconnect the RCM 2.0 cable from the power distribution board and remove the chassis PDB assembly. Remove the 1U left rear I/O blank Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Place the node on a flat, level surface.

  • Page 37: Remove The 2U Rear I/O Blank

    Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Place the node on a flat, level surface. Do one of the following: Remove the 1U left rear I/O blank (on page 36). Remove the single-slot left PCI riser cage assembly (on page 41). Remove the 1U right rear I/O blank.

  • Page 38: Remove The Air Baffle

    Remove the 2U rear I/O blank. Remove the air baffle Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Place the node on a flat, level surface. If installed in a 2U node, remove the FlexibleLOM 2U node riser cage assembly ("FlexibleLOM 2U node riser cage...

  • Page 39: Remove The Bayonet Board Assembly

    2U air baffle Remove the bayonet board assembly Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Place the node on a flat, level surface. If installed in a 2U node, remove the FlexibleLOM 2U node riser cage assembly ("FlexibleLOM 2U node riser cage assembly"...

  • Page 40: Remove The Bayonet Board Bracket

    1U bayonet board assembly 2U bayonet board assembly Remove the bayonet board bracket Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Place the node on a flat, level surface. If installed in a 2U node, remove the FlexibleLOM 2U node riser cage assembly ("FlexibleLOM 2U node riser cage...

  • Page 41: Remove The Pci Riser Cage Assembly

    If a B140i SATA cable is installed, disconnect it from the connectors on the system board. Remove the bayonet board assembly from the node ("Remove the bayonet board assembly" on page 39). Remove the bayonet board bracket from the bayonet board. 1U bayonet board bracket 2U bayonet board bracket Remove the PCI riser cage assembly...
  • Page 42 Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Place the node on a flat, level surface. In a 2U node, remove the three-slot riser cage assembly ("Three-slot PCI riser cage assemblies" on page 46).
  • Page 43 Single-slot 1U node right PCI riser cage assembly To remove the component: Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Do one of the following: Remove the 1U left rear I/O blank (on page 36).
  • Page 44 Remove the FlexibleLOM 1U node riser cage assembly. CAUTION: To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed.
  • Page 45 Remove the single-slot 2U node PCI riser cage assembly. CAUTION: To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed.

  • Page 46: Power Distribution Board (Pdb)

    Three-slot PCI riser cage assemblies NOTE: The three-slot PCI riser cage assembly and the three-slot GPU-direct PCI riser cage assembly, share the same riser cage but have a different riser board. For more information on the riser board slot specifications, see "PCIe riser board slot definitions (on page 114)." To remove the component: Power down the node (on page 27).
  • Page 47 If an HP Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. Remove the PDB cover (on page 31).

  • Page 48: Pdb Pass-Through Board

    Using a T-15 Torx screwdriver, remove the RPS link board assembly. To replace the component, reverse the removal procedure. PDB pass-through board To remove the component: Power down the system (on page 27). Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis ("Remove the node from the chassis"...
  • Page 49 If an HP Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. Remove the PDB cover (on page 31).

  • Page 50: Rps Link Board

    Using a T-15 Torx screwdriver, remove the support bracket. To replace the component, reverse the removal procedure. RPS link board Power down the system (on page 27). Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis ("Remove the node from the chassis"...
  • Page 51 If an HP Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. Remove the PDB cover (on page 31).

  • Page 52: Rcm 2.0 Cable

    Remove the support bracket from the RPS link board. To replace the component, reverse the removal procedure. RCM 2.0 cable To remove the component: Power down the system (on page 27). Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis ("Remove the node from the chassis"...
  • Page 53 If an HP Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. Remove the PDB cover (on page 31).

  • Page 54: Drive Backplane

    ("Remove the chassis access panel" on page 32). If an HP Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable.

  • Page 55: Fan Module

    12 low-profile LFF drive backplane for HP Apollo r2200 Chassis 24 SFF drive backplane for HP Apollo r2600 Chassis To replace the component, reverse the removal procedure. Fan module To remove the component: Power down the system (on page 27).

  • Page 56: Hp Smart Storage Battery

    Disconnect the cable from the fan cage. Remove the fan module. To replace the component, reverse the removal procedure. HP Smart Storage Battery WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
  • Page 57 Remove the access panel ("Remove the chassis access panel" on page 32). Slightly pull up the battery holder from the chassis to access the battery cable connection underneath it, and then disconnect the HP Smart Storage Battery cable. Removal and replacement procedures 57...

  • Page 58: Hot-Plug Drive

    Remove the HP Smart Storage Battery from its holder. To replace the component, reverse the removal procedure. Hot-plug drive CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

  • Page 59: Bezel Ear

    Low-profile LFF hot-plug drive To replace the component, reverse the removal procedure. Bezel ear To remove the component: Power down the system (on page 27). Disconnect all peripheral cables from the nodes and chassis. Remove all nodes from the chassis ("Remove the node from the chassis"...
  • Page 60 Right front I/O cable cover Left front I/O cable cover Disconnect the front I/O cable from the drive backplane. Remove the bezel ear. Removal and replacement procedures 60...

  • Page 61: Fbwc Module

    Right bezel ear Left bezel ear Disconnect the front I/O cable from the bezel ear. To replace the component, reverse the removal procedure. FBWC module WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
  • Page 62 CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge. To remove the component: Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27).

  • Page 63: Rcm 2.0 To 1.0 Adapter Cable

    To remove the component: Power down the system (on page 27). Disconnect the RCM 2.0 to 1.0 adapter cable from HP APM. Disconnect the RCM 2.0 to 1.0 adapter cable from the RCM module. To replace the component, reverse the removal procedure.

  • Page 64: Enabling The Dedicated Ilo Management Module

    Remove the failed dedicated iLO management port card. To replace the component, reverse the removal procedure. Enabling the dedicated iLO management module To enable the dedicated iLO management module: During the server startup sequence after installing the module, press F9 in the POST screen. The System Utilities screen appears.
  • Page 65 Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Remove the PCI riser cage assembly (on page 41). Remove all expansion boards from the riser cage assembly. Disconnect any internal cables that are connected to the expansion board. If replacing a riser board in a three-slot riser cage assembly, remove the PCIe transfer board ("PCIe transfer...
  • Page 66 PCIe x16 right 1U node riser board FlexibleLOM x8 1U node riser board Removal and replacement procedures 66...
  • Page 67 FlexibleLOM x16x8 2U node riser board Three-slot PCIe x16 2U node riser board Removal and replacement procedures 67...

  • Page 68: Pcie Transfer Board

    Three-slot GPU-direct PCIe x16 2U node riser board To replace the component, reverse the removal procedure. PCIe transfer board To remove the component: Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Remove the three-slot PCI riser cage assembly ("Three-slot PCI riser cage assemblies"...

  • Page 69: M.2 Sata Ssd Enablement Board

    To replace the component, reverse the removal procedure. M.2 SATA SSD enablement board To remove the component: Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). In a 2U node, do one of the following: Remove the three-slot PCI riser cage assembly ("Three-slot PCI riser cage...
  • Page 70 Single-slot 2U node PCI riser cage assembly Loosen the T-10 screw and remove the M2. SATA SSD cards from the failed enablement board. Remove the first M.2 SATA SSD card Removal and replacement procedures 70...

  • Page 71: Heatsink

    Remove the second M.2 SATA SSD card To replace the component, reverse the removal procedure. Heatsink WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this node.
  • Page 72 Remove the heatsink. To replace the component: Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. Remove the thermal interface protective cover from the heatsink. CAUTION: Heatsink retaining screws should be tightened in diagonally opposite pairs (in an "X" pattern).

  • Page 73: Processor

    Finish the installation by completely tightening the screws in the same sequence. Install the air baffle. Install any removed PCI riser cage assemblies. Install the node into the chassis. Connect all peripheral cables to the node. Power up the node. Processor WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the...
  • Page 74 To remove the component: Power down the node (on page 27). Disconnect all peripheral cables from the node. Remove the node from the chassis (on page 27). Place the node on a flat, level surface. In a 2U node, do one of the following: Remove the three-slot PCI riser cage assembly ("Three-slot PCI riser cage assemblies"...
  • Page 75 Remove the processor from the processor retaining bracket. To replace the component: Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 76 CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board, do not touch the processor or the processor socket contacts. CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board.
  • Page 77 Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution. Install the heatsink: Position the heatsink on the processor backplate.

  • Page 78: Expansion Board

    Expansion board WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

  • Page 79: System Battery

    Remove the DIMM. To replace the component, reverse the removal procedure. System battery If the node no longer automatically displays the correct date and time, then replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack.

  • Page 80: System Board

    Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery, reconfigure the system through RBSU. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
  • Page 81 Remove the air baffle (on page 38). Remove all DIMMs ("DIMMs" on page 78). Remove the heatsink: Loosen one pair of diagonally opposite screws halfway, and then loosen the other pair of screws. Completely loosen all screws in the same sequence. Remove the heatsink from the processor backplate.
  • Page 82 Remove the processor from the processor retaining bracket. If installed, remove the dedicated iLO module ("Dedicated iLO management port module option" on page 63). Disconnect all cables connected to the system board. Remove the failed system board. Removal and replacement procedures 82...
  • Page 83 To replace the system board: Install the system board. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket. Removal and replacement procedures 83...
  • Page 84 Remove the clear processor socket cover. Retain the processor socket cover for future use. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
  • Page 85 CAUTION: Close and hold down the processor cover socket while closing the processor locking levers. The levers should close without resistance. Forcing the levers closed can damage the processor and socket, requiring system board replacement. Close the processor retaining bracket. When the processor is installed properly inside the processor retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

  • Page 86: Re-Entering The Server Serial Number And Product Id

    Position the heatsink on the processor backplate. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. Finish the installation by completely tightening the screws in the same sequence. Install all components removed from the failed system board. Install the air baffle.

  • Page 87: Hp Trusted Platform Module

    If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.

  • Page 88: Troubleshooting

    • Simplified Chinese (http://www.hp.com/support/Gen9_TSG_zh_cn) The HP ProLiant Gen9 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language: •...

  • Page 89: Diagnostic Tools

    Diagnostic tools HP UEFI System Utilities The HP UEFI System Utilities is embedded in the system ROM. The UEFI System Utilities enable you to perform a wide range of configuration activities, including: • Configuring system devices and installed options •...

  • Page 90: Flexible Boot Control

    OS installation if the defaults are restored. To avoid this issue, use the User Defined Defaults feature in UEFI System Utilities to override the factory default settings. For more information, see the HP UEFI System Utilities User Guide for HP ProLiant Gen9 Servers on the HP website (http://www.hp.com/go/ProLiantUEFI/docs).

  • Page 91: Embedded Uefi Shell

    Embedded UEFI shell The system BIOS in all HP ProLiant Gen9 servers includes an Embedded UEFI Shell in the ROM. The UEFI Shell environment provides an API, a command line prompt, and a set of CLIs that allow scripting, file manipulation, and system information.

  • Page 92: Hp Proliant Pre-Boot Health Summary

    Resources (on page 88)." HP Insight Diagnostics HP Insight Diagnostics is a proactive node management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify node installations, troubleshoot problems, and perform repair validation.

  • Page 93: Integrated Management Log

    HP Active Health System does not parse or change operating system data from third-party error event log activities, such as content created or passed through by the operating system. The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy).

  • Page 94: Usb Support

    USB support HP nodes support both USB 2.0 ports and USB 3.0 ports. Both types of ports support installing all types of USB devices (USB 1.0, USB 2.0, and USB 3.0), but may run at lower speeds in specific situations: •...

  • Page 95: Internal Usb Functionality

    Internal USB functionality An internal USB connector is available for use with security key devices and USB drive keys. This solution provides for use of a permanent USB key installed in the internal connector, avoiding issues of clearance on the front of the rack and physical access to secure data. Diagnostic tools 95...

  • Page 96: Component Identification

    Component identification Chassis front panel components • HP Apollo r2200 Chassis Item Description Left bezel ear Low-profile LFF hot-plug drives Right bezel ear Chassis serial label pull tab • HP Apollo r2600 Chassis Item Description Left bezel ear SFF HP SmartDrives...

  • Page 97: Chassis Front Panel Leds And Buttons

    Chassis front panel LEDs and buttons Item Description Status Power On/Standby button and Solid green = System on system power LED (Node 1)* Flashing green = Performing power on sequence Solid amber = System in standby Off = No power present** Power On/Standby button and Solid green = System on system power LED (Node 2)*...

  • Page 98: Chassis Rear Panel Components

    Item Description Status Power On/Standby button and Solid green = System on system power LED (Node 3)* Flashing green = Performing power on sequence Solid amber = System in standby Off = No power present** * When the LEDs described in this table flash simultaneously, a power fault has occurred. For more information, see "Power fault LEDs (on page 103)."...

  • Page 99: Chassis Rear Panel Leds

    Item Description RCM module Power Supply 2 Power Supply 1 Node 1 Chassis rear panel LEDs Item Description Status Power supply 2 LED Solid green = Normal Off = One or more of the following conditions exists: • Power is unavailable •...

  • Page 100: Node Rear Panel Components

    Node rear panel components • 1U node rear panel components Item Description Node serial number and iLO label pull tab SUV connector USB 3.0 connector Dedicated iLO port (optional) NIC connector 1 NIC connector 2 • 2U node rear panel components Item Description Node serial number and iLO label pull tab...

  • Page 101: Node Rear Panel Leds And Buttons

    Node rear panel LEDs and buttons • 1U node Item Description Status Power button/LED* Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present** UID button/LED* Solid blue = Activated Flashing blue:...
  • Page 102 Item Description Status iLO link LED Green = Linked to network Off = No network connection NIC link LED* Green = Linked to network Off = No network connection NIC activity LED* Green or flashing green = Network activity Off = No network activity * When the LEDs described in this table flash simultaneously, a power fault has occurred.

  • Page 103: Power Fault Leds

    SAS HBA controller 7 flashes System board PCIe slots 8 flashes Power backplane or storage backplane 9 flashes Power supply System board components NOTE: HP ProLiant XL170r and XL190r Gen9 Server Nodes share the same system board. Component identification 103...

  • Page 104: System Maintenance Switch

    Item Description Bayonet board slot DIMMs for processor 2 DIMMs for processor 1 PCIe x40 riser board connector* System maintenance switch Mini-SAS connector 1 (SATA x4) Internal USB 3.0 connector Mini-SAS connector 2 (SATA x4) PCIe x24 riser board connector* Dedicated iLO port connector NMI header PCIe x16 riser board connector*...

  • Page 105: Nmi Functionality

    IMPORTANT: Before using the S7 switch to change to Legacy BIOS Boot Mode, be sure the HP Dynamic Smart Array B140i Controller is disabled. Do not use the B140i controller when the server is in Legacy BIOS Boot Mode.

  • Page 106: Dimm Slot Locations

    DIMM slot locations DIMM slots are numbered sequentially (1 through 8) for each processor. The supported AMP modes use the letter assignments for population guidelines. NOTE: The arrow indicates the front of the chassis. Fan locations Drive numbering Component identification 106...

  • Page 107: Hp Apollo R2200 Chassis Drive Numbering

    Node 3 corresponds to drives 3-1 through 3-6. • Node 4 corresponds to drives 4-1 through 4-6. If a P840 Smart Array controller is installed, one 2U node corresponds to a maximum of twelve SFF HP SmartDrives. • Node 1 corresponds to drives 1-1 through 2-6.
  • Page 108 Node 3 corresponds to drives 3-1 through 4-6. One 2U node corresponds to a maximum of eight SFF HP SmartDrives if using the HP Dynamic Smart Array B140i Controller, HP H240 Host Bus Adapter, or HP P440 Smart Array Controller.

  • Page 109: M.2 Sata Ssd Bay Numbering

    Hot-plug drive LED definitions HP SmartDrive LED definitions HP SmartDrives are the latest HP drive technology, and they are supported beginning with ProLiant Gen8 servers and server blades. The HP SmartDrive is not supported on earlier generation servers and server blades.
  • Page 110 The blue Locate LED is behind the release lever and is visible when illuminated. IMPORTANT: The HP Dynamic Smart Array B140i Controller is only available in UEFI Boot Mode. It cannot be enabled in Legacy BIOS Boot Mode. If the B140i controller is disabled, drives connected to the system board Mini-SAS connectors operate in AHCI or Legacy mode.

  • Page 111: Low-Profile Lff Hot-Plug Drive Led Definitions

    Low-profile LFF hot-plug drive LED definitions Item Definition Fault/UID (amber/blue) Online/Activity (green) Online/activity Fault/UID LED Definition LED (green) (amber/blue) Alternating amber The drive has failed, or a predictive failure alert has been received for On, off, or and blue this drive; it also has been selected by a management application. flashing Steadily blue The drive is operating normally, and it has been selected by a...

  • Page 112: Rcm Module Components

    HP APM 2.0 connector iLO connector IMPORTANT: Use either the HP APM port or an iLO port to connect to a network. Having both ports connected at the same time results in a loopback condition. IMPORTANT: Do not connect both iLO ports to the network at the same time. Only one iLO port can be connected to the network, while the other iLO port can be used only as a connection to a second enclosure.

  • Page 113: Rcm Module Leds

    RCM module LEDs Item Description iLO activity LED Green or flashing green = Network activity Off = No network activity iLO link LED Green = Linked to network Off = No network connection iLO link LED Green = Linked to network Off = No network connection iLO activity LED Green or flashing green = Network activity Off = No network activity...

  • Page 114: Pcie Riser Board Slot Definitions

    PCIe riser board slot definitions • Single-slot left PCI riser cage assembly Form factor Slot number Slot description PCIe3 x16 (16, 8, 4, 1) for Low-profile PCIe card Processor 1 • Single-slot 1U node right PCI riser cage assembly Form factor Slot number Slot description PCIe3 x16 (16, 8, 4, 1) for...
  • Page 115 • FlexibleLOM 1U node riser cage assembly Form factor Slot number Slot description FlexibleLOM slot PCIe3 x8 for Processor 1 FlexibleLOM • Single-slot 2U node PCI riser cage assembly Form factor Slot number Slot description PCIe3 x16 (16, 8, 4, 1) for Low-profile PCIe card Processor 1 Component identification 115...
  • Page 116 • FlexibleLOM 2U node riser cage assembly Item Form factor Slot number Slot description FlexibleLOM FlexibleLOM slot PCIe3 x8 for Processor 1 Storage controller or graphic PCIe3 x16 (16, 8, 4, 1) for card Processor 1 • Three-slot PCI riser cage assembly Item Form factor Slot number...
  • Page 117 • Three-slot GPU-direct PCI riser cage assembly Item Form factor Slot number Slot description Storage controller or graphic PCIe3 x16 (16, 8, 4, 1) for card Processor 2 Low-profile PCIe NIC card PCIe3 x16 (16, 8, 4, 1) for Processor 2 Graphic card PCIe3 x16 (16, 8, 4, 1) for Processor 2...

  • Page 118: Cabling

    Cabling Chassis cabling Front I/O cabling Item Description Left front I/O cable Right front I/O cable Cabling 118...

  • Page 119: Drive Backplane Power Cabling

    Drive backplane power cabling HP Apollo r2600 Chassis Item Description Power cable for Node 1 and Node 2 Power cable for drives Power cable for Node 3 and Node 4 PDB pass-through cable HP Apollo r2200 Chassis Item Description Power cable for Node 1 and Node 2...

  • Page 120: Rcm 2.0 Cabling

    Item Description Power cable for drives Power cable for Node 3 and Node 4 PDB pass-through cable RCM 2.0 cabling Fan power cabling Cabling 120...

  • Page 121: Fan Cabling

    Fan cabling Item Description Fan 1 cable Fan 2 cable Fan 3 cable Fan 4 cable Fan 5 cable Fan 6 cable Fan 7 cable Fan 8 cable HP Smart Storage Battery cabling Cabling 121...

  • Page 122: Node Cabling

    Node cabling Storage cabling B140i 1U node SATA cabling B140i 2U node SATA cabling Mini-SAS H240 1U node cabling Cabling 122...
  • Page 123 Mini-SAS H240 2U node cabling Mini-SAS P440 2U node cabling Mini-SAS P440/P840 cabling HP P440 Smart Array controller installed in a 1U node Cabling 123...

  • Page 124: Graphic Card/ Coprocessor Cabling

    HP P840 Smart Array controller installed in a 2U node Graphic card/ coprocessor cabling NOTE: Graphic card/ coprocessor cabling may vary slightly depending on the type of graphic/ coprocessor installed. Single graphic card/ coprocessor power cabling Dual graphic card/ coprocessor power cabling...

  • Page 125: Fbwc Module Cabling

    FBWC module cabling The FBWC solution is a separately purchased option. This node only supports FBWC module installation when an HP Smart Array P-Series controller is installed. Depending on the controller option installed, the actual storage controller connectors might look different from what is shown in this section.
  • Page 126 HP P440 Smart Array controller in a single-slot left PCI riser cage assembly HP P440 Smart Array controller in a single-slot 2U node PCI riser cage assembly HP P840 Smart Array controller in a FlexibleLOM 2U node riser cage assembly...
  • Page 127 HP P840 Smart Array controller in a three-slot PCI riser cage assembly HP P840 Smart Array controller in a three-slot GPU-direct PCI riser cage assembly Cabling 127...

  • Page 128: Specifications

    40°C to 45°C (104°F to 113°F) at sea level with an altitude derating of 1.0°C per every 125 m (1.8°F per every 410 ft) above 900 m (2953 ft) to a maximum of 3048 m (10,000 ft). The approved hardware configurations for this system are listed on the HP website (http://www.hp.com/servers/ASHRAE).

  • Page 129: Power Supply Specifications

    Depending on installed options, the node is configured with one of the following power supplies: • HP 800W Flex Slot Titanium Hot Plug Power Supply Kit – 96% efficiency • HP 800W Flex Slot Platinum Hot Plug Power Supply Kit – 94% efficiency •...

  • Page 130: Hot-Plug Power Supply Calculations

    • HP 1400W Flex Slot Platinum Plus Hot Plug Power Supply Kit – 94% efficiency For detailed power supply specifications, see the QuickSpecs on the HP website (http://h18000.www1.hp.com/products/quickspecs/14209_div/14209_div.html). Hot-plug power supply calculations For hot-plug power supply specifications and calculators to determine electrical and heat loading for the server, see the HP website (http://www.hp.com/go/hppoweradvisor).

  • Page 131: Acronyms And Abbreviations

    American Society of Heating, Refrigerating and Air-Conditioning Engineers backplane Customer Self Repair file allocation table FBWC flash-backed write cache graphics processing unit host bus adapter HP SIM HP Systems Insight Manager Integrated Lights-Out Integrated Management Log Acronyms and abbreviations 131...
  • Page 132 large form factor Lights-Out Management nonmaskable interrupt NVRAM nonvolatile memory Optical Disk Drive PCIe Peripheral Component Interconnect Express power distribution board POST Power-On Self Test RBSU ROM-Based Setup Utility REST representational state transfer redundant power supply serial attached SCSI SATA serial ATA Secure Digital Acronyms and abbreviations 132...
  • Page 133 Systems Insight Manager HP Service Pack for ProLiant Trusted Platform Module UEFI Unified Extensible Firmware Interface unit identification universal serial bus Acronyms and abbreviations 133...

  • Page 134: Documentation Feedback

    Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.

  • Page 135: Index

    89, 90, 91 buttons 96 buttons, front panel 96 heatsink 71 hot-plug drive 58 HP Advanced Power Manager (HP APM) 89 HP Insight Diagnostics 92 cables 118 HP ProLiant Pre-boot Health Summary 92 cabling 118 HP RESTful API 91...
  • Page 136 utilities 89 part numbers 16 pass-through board 48 warnings 25, 26 PCI riser board slot definitions 114 power distribution board (PDB) 46 power requirements 130 power supply 130 power supply specifications 129, 130 powering down 27 processor 73 Product ID 91 Rack Control Managment (RCM) module 63 rack warnings 26 rear panel components 98, 100...

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