2 x 8 w stereo btl audio output amplifier with dc volume control (17 pages)
Summary of Contents for Philips TDA8542
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DATA SHEET TDA8542 1 W BTL audio amplifier Product specification Supersedes data of 1997 Feb 19 File under Integrated Circuits, IC01 INTEGRATED CIRCUITS 1998 Apr 01...
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Portable consumer products Personal computers Motor-driver (servo). GENERAL DESCRIPTION The TDA8542(T) is a two channel audio power amplifier for an output power of 2 supply. The circuit contains two BTL amplifiers with a complementary PNP-NPN output stage and standby/mute logic. The TDA8542T comes in a 16 pin SO package and the TDA8542 in a 16 pin DIP package.
Philips Semiconductors 1 W BTL audio amplifier BLOCK DIAGRAM handbook, full pagewidth MODE BTL/SE 1998 Apr 01 V CCL V CCR V CCL 20 k 20 k STANDBY/MUTE LOGIC TDA8542 V CCR 20 k 20 k STANDBY/MUTE LOGIC Fig.1 Block diagram.
MGB974 Fig.2 Pin configuration. 1998 Apr 01 FUNCTIONAL DESCRIPTION The TDA8542(T) is a 2 DESCRIPTION capable of delivering 2 at THD = 10% using a 5 V power supply. Using the MODE pin the device can be switched to standby and mute condition.
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In accordance with “SNW-FQ-611-E” . The number of the quality specification can be found in the “Quality Reference Handbook” . The handbook can be ordered using the code 9397 750 00192. THERMAL CHARACTERISTICS SYMBOL thermal resistance from junction to ambient in free air: th j-a TDA8542T (SO16L) TDA8542 (DIP16) 1998 Apr 01 CONDITIONS operating non-operating SO16L DIP16 PARAMETER Product specification...
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Philips Semiconductors 1 W BTL audio amplifier DC CHARACTERISTICS = 5 V; T = 25 C; R = 8 ; V SYMBOL PARAMETER supply voltage quiescent current standby current DC output voltage differential output voltage offset OUT+ input bias current...
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Philips Semiconductors 1 W BTL audio amplifier AC CHARACTERISTICS = 5 V; T = 25 C; R = 8 ; f = 1 kHz; V SYMBOL PARAMETER output power total harmonic distortion closed loop voltage gain differential input impedance noise output voltage...
Philips Semiconductors 1 W BTL audio amplifier TEST AND APPLICATION INFORMATION Test conditions Because the application can be either Bridge-Tied Load (BTL) or Single-Ended (SE), the curves of each application are shown separately. The thermal resistance = 55 K/W for the DIP16; the...
Philips Semiconductors 1 W BTL audio amplifier BTL APPLICATION handbook, full pagewidth 10 k V iL 10 k V iR Gain left ------- - Gain right ------- - handbook, halfpage (mA) RI = . Fig.4 I as a function of V...
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Philips Semiconductors 1 W BTL audio amplifier handbook, halfpage = 0.5 W, G = 20 dB. (1) V = 5 V, R = 8 . (2) V = 9 V, R = 16 . Fig.6 THD as a function of frequency.
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Philips Semiconductors 1 W BTL audio amplifier handbook, halfpage (1) R = 8 . (2) R = 16 . Fig.10 Worst case power dissipation as a function of V handbook, halfpage Band-pass = 22 Hz to 22 kHz. (1) V = 3 V.
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Philips Semiconductors 1 W BTL audio amplifier SE APPLICATION handbook, full pagewidth 10 k V iL 10 k V iR Gain left ------- - Gain right ------- - handbook, halfpage f = 1 kHz, G = 20 dB. (1) V = 7.5 V, R...
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Philips Semiconductors 1 W BTL audio amplifier handbook, halfpage (dB) = 1 V, G = 20 dB. (1) V = 5 V, R = 32 , to buffer. (2) V = 7.5 V, R = 4 . (3) V = 9 V, R = 8 .
Philips Semiconductors 1 W BTL audio amplifier handbook, halfpage Sine wave of 1 kHz. (1) V = 12 V, R = 16 . (2) V = 7.5 V, R = 4 . (3) V = 9 V, R = 8 .
Philips Semiconductors 1 W BTL audio amplifier handbook, full pagewidth MODE 1998 Apr 01 a. Top view. V CC 100 F OUT1 12 k 12 k 100 nF 56 k TDA8542 47 F 56 k OUT2 b. Component side. Fig.22 Printed-circuit board layout (BTL and SE).
Philips Semiconductors 1 W BTL audio amplifier PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 7.5 mm pin 1 index DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT max. 0.30 2.45 2.65 0.25 0.10 2.25...
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Philips Semiconductors 1 W BTL audio amplifier DIP16: plastic dual in-line package; 16 leads (300 mil); long body pin 1 index DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT max. min. max. 0.51 inches 0.19 0.020 0.15 Note 1.
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Philips Semiconductors 1 W BTL audio amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities.
Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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