Product data sheet 1. General description The TDA8920B is a high efficiency class-D audio power amplifier with very low dissipation. The typical output power is 2 × 100 W. The device is available in the HSOP24 power package and in the DBS23P through-hole power package.
For protection a temperature sensor and a maximum current detector are built-in. The two audio channels of the TDA8920B contain two PWM modulators, two analog feedback loops and two differential input stages. It also contains circuits common to both channels such as the oscillator, all reference sources, the mode functionality and a digital timing manager.
(the amplifier is NOT shut-down completely). The amplifier can distinguish between an impedance drop of the loudspeaker and a low-ohmic short across the load. In the TDA8920B this impedance threshold (Z depends on the supply voltage used. When a short is made across the load causing the impedance to drop below the threshold level (<...
----------------------------------- - th j a – diss is determined by the efficiency (η) of the TDA8920B. The efficiency measured in the diss TDA8920B as a function of output power is given in Figure 21. The power dissipation can...
8 A (e.g. in case of a short-circuit to the supply lines or a short-circuit across the load) the maximum output current of the amplifier will be regulated to 8 A. The TDA8920B amplifier can distinguish between a low-ohmic short circuit condition and other overcurrent conditions like dynamic impedance drops of the loudspeakers used. The impedance threshold (Z ) depends on the supply voltage used.
If the overcurrent condition is removed the amplifier will remain in Operating mode once restarted. In this way the TDA8920B amplifier is fully robust against short circuit conditions while at the same time so-called audio holes as a result of loudspeaker impedance drops are eliminated.
Page 21
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx 10 Ω L1 BEAD 5.6 kΩ CON1 +25 V 5.6 kΩ 47 µF/35 V 470 µF/35 V 100 nF 5.6 kΩ...
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect).
This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product.
Need help?
Do you have a question about the TDA8920B and is the answer not in the manual?
Questions and answers